ORGANIZERS:
Eric Bernier (HiSilicon OE)
Martijn Heck (Eindhoven University of Technology)
Lars Zimmermann (IHP Microelectronics)
ABSTRACT:
Photonic Integrated Circuits (PICs) have long been anticipated as a revolution for the optical components market. With the advent of AI, the potential for PICs to scale production volumes to unprecedented levels has never been more attainable. But is this the moment when the long-anticipated mass adoption of PICs becomes a reality?
The commercial success of PICs hinges on integrating diverse material platforms and innovative light source strategies. As the industry debates the merits of silicon photonics (SiP) versus indium phosphide (InP) technologies, a new frontier is emerging—one that leverages hybrid and heterogeneous integration to combine the strengths of these and other materials, such as Lithium Niobate and phase-change materials. Which platform, and which functionality, is really needed?
AGENDA:
Session 1 - Requirement for Photonics platforms
• Introduction
• Mark Lutkowitz (Fibre Reality), "Where should the optical industry be going?"
• Abdul Rahim (PhotonDelta), "IPSRI Roadmap"
• Gernot Fasching (Huawei), "Platforms requirements for 400Gbps and beyond"
• Marco Vitali (fJscaler), "Perspectives of analog IC design"
• Panel Discussion
Session 2 – Platform and components availability
• Introduction
• Ken Giewont (Global Foudries), "GF’s silicon photonics foundry platform"
• Luc Augustin (Smart Photonics), "InP Platform for Advanced photonics applications"
• Steven Alleston (Openlight Photonics), "Perspective from a Heterogeneous Silicon Platform"
• Felix Eltes (Lumiphase), "Advances in BTO modulator technology"
• Panel Discussion